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12 nm · Bulk FinFET

LM12FF-G

12 nm FinFET, general purpose

Status

Technology description complete; device models in progress.

The five kits at the same scale: LM12FF-G's fins in the middle
The five kits at the same scale: LM12FF-G's fins in the middle

LM12FF-G is a 12/16 nm-class bulk FinFET kit, the family's first three-dimensional transistor. Current flows along tall, thin silicon fins, 42 nm tall and 8 nm wide, wrapped by the gate on three sides. That gives far better control of leakage at short gate lengths than a planar transistor, which is why FinFETs replaced planar devices below 20 nm.

Why 12/16 nm FinFET

The 12/16 nm class is the workhorse FinFET generation: mature, widely used for application processors, networking, AI accelerators and automotive compute, and the first node where many design effects tied to fins (quantized transistor width, self-heating, temperature inversion) appear.

Technology at a glance

Supply0.75 V nominal
Contacted gate pitch90 nm
Gate length30–34 nm
Fin pitch / height / width48 / 42 / 8 nm
Equivalent oxide thickness0.8 nm
Metal stack11 layers, 64 nm minimum pitch
Cell heights7.5 and 9 tracks
Threshold voltagesSVT, LVT, ULVT
Device modelBSIM-CMG

Transistors

Transistor width comes in whole fins, so drive strength is quantized: a design choice our cell generator handles directly. Leakage targets are met; drive currents are being refined against published 16 nm and 14 nm data before the libraries are built.

Id–Vg of the fitted FinFET devices (work in progress)
Id–Vg of the fitted FinFET devices (work in progress)

Interconnect

The stack to scale
The stack to scale
Resistance and capacitance per metal layer
Resistance and capacitance per metal layer

Fins are thermally isolated: they heat up while switching, and the heat has few paths out. At the same time, at low supply voltages FinFET circuits get faster as they get hotter (temperature inversion). Both change which operating condition is the worst case for timing. We will quantify them so that our tools pick the right corners.

Built from

Published 16 nm and 14 nm FinFET process papers, international roadmap tables (ITRS 2013), and the ASAP7 research kit's layout rules, scaled to this node.

Next

Final device fit, then standard-cell libraries at two heights and three threshold flavours, then characterization, following the same flow as LM40PB-L.

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